PIC (Peripheral Interface Controller) controllers are a family of microcontrollers. They are widely used in various applications due to their versatility, ease of use, and availability in different configurations and are also used in ASIC miners. The process of making PIC controllers involves several steps, including design, fabrication, testing, and packaging. Here's a general overview of how PIC controllers are made:
1. Design: The process begins with the design of the microcontroller. Engineers and designers at Microchip Technology create the architecture, instruction set, and specifications for the PIC microcontroller. This involves determining the type and number of integrated circuits, memory capacity, number of input/output pins, communication interfaces, and other features.
2. Integrated Circuit (IC) Design: The internal components of the microcontroller, such as the central processing unit (CPU), memory, timers, and other peripherals, are designed using electronic design automation (EDA) software. This involves creating digital circuit designs and layout patterns for these components.
3. Fabrication: The IC fabrication process takes place in a semiconductor manufacturing facility, also known as a fab. The fabrication process involves several key steps:
- Wafer Fabrication: A silicon wafer is used as the base material for the microcontroller. The wafer goes through a series of photolithography and etching steps to create the intricate circuit patterns.
- Deposition: Thin layers of materials, such as metal and insulating materials, are deposited onto the wafer using techniques like chemical vapor deposition (CVD) or physical vapor deposition (PVD).
- Lithography: Photolithography is used to transfer the design patterns onto the wafer's surface. A photoresist layer is applied, exposed to light through a mask with the circuit pattern, and then chemically treated to create the desired patterns.
- Etching: Chemical or plasma etching is used to remove excess material and create the final circuit structure on the wafer.
- Doping: Ion implantation or diffusion is used to introduce impurities (dopants) into the silicon to create regions with different electrical properties, such as creating transistors.
4. Testing: After the fabrication process, the wafers undergo testing to identify any defects or issues. This testing can involve various techniques, such as electrical testing, functional testing, and performance testing.
5. Die Separation: Once the wafers pass testing, they are diced into individual die (chips), each containing one PIC microcontroller.
6. Packaging: The individual die are placed in packages that provide protection, electrical connections, and heat dissipation. The packaging can be in the form of surface-mount devices (SMD) or through-hole packages.
7. Final Testing: After packaging, the microcontrollers undergo final testing to ensure they meet the specified performance and functional requirements.
8. Programming: Some PIC microcontrollers are pre-programmed during the manufacturing process with firmware or bootloader code, while others can be programmed by end-users.
9. Distribution: The completed and tested PIC microcontrollers are then distributed to customers, who integrate them into their products and applications.
It's important to note that this overview provides a general understanding of the process, and the specifics can vary depending on the technology used, the generation of PIC controllers, and the manufacturing facility. The fabrication of microcontrollers is a highly complex and specialized process that requires expertise in various fields of engineering and manufacturing.